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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/075562
Kind Code:
A1
Abstract:
A curable composition which comprises a vinyl polymer (I) having at least one crosslinkable silyl group and having a main chain formed through a living radical polymerization method and an antioxidant(II). The curable composition can provide a rubbery cured product which is improved in weatherproof adhesiveness to a transparent photocatalyst-coated article to be adhered while retaining the adhesiveness to a substrate for general use, exhibits a low modulus and a high elongation, and further has such high weather resistance that it is free from the occurrence of a crack or the discoloration on the surface thereof even when used outdoors for a long period of time.

Inventors:
TAMAI HITOSHI (JP)
YANO AYAKO (JP)
Application Number:
PCT/JP2005/001048
Publication Date:
August 18, 2005
Filing Date:
January 20, 2005
Export Citation:
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Assignee:
KANEKA CORP (JP)
TAMAI HITOSHI (JP)
YANO AYAKO (JP)
International Classes:
C08F4/72; C08F8/42; C08K5/00; C08L57/06; C09J157/06; C09J171/00; C09J183/04; C09K3/10; (IPC1-7): C08L57/06; C08F4/72; C08F8/42; C08K5/00; C09J157/06; C09J171/00; C09J183/04; C09K3/10
Domestic Patent References:
WO2002085985A12002-10-31
WO2003091291A12003-11-06
WO2004074381A12004-09-02
Foreign References:
JP2003113324A2003-04-18
JP2003313302A2003-11-06
JP2003313397A2003-11-06
JP2001180979A2001-07-03
JP2002194876A2002-07-10
JP2003327620A2003-11-19
JP2004156023A2004-06-03
JP2003344180A2003-12-03
JP2003113324A2003-04-18
EP0108946A21984-05-23
EP1288247A12003-03-05
EP1371670A12003-12-17
JPH0469659B21992-11-06
JPH07108928B21995-11-22
JPS63254149A1988-10-20
JPS6422904A1989-01-25
Other References:
"Handbook of Antioxidants", TAISEISHA LTD.
"Degradation and Stabilization of Polymer Materials", CMC PUBLISHING CO., LTD, pages: 235 - 242
"Photosensitive Resins", 17 March 1972, INSATSU GAKKAI SHUPPANBU, pages: 93, 106, - 117
See also references of EP 1715002A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka 88, JP)
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