CURABLE COMPOSITION - MITSUBISHI GAS CHEMICAL CO

Title:

CURABLE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2006/123731

Kind Code:

A1

Abstract:

A curable composition which comprises 1 to 50 parts by weight of an inorganic compound (A) having a sulfur or selenium atom and 50 to 99 parts by weight of a compound (B) represented by the general formula (1): [wherein m is an integer of 0 to 4; and n is an integer of 0 to 2] (with the proviso that the total amount of the compounds (A) and (B) is 100 parts by weight) and which further contains at least one compound (C) selected from the group consisting of thiol compounds each having one SH group and disulfide compounds (except the compound (B)) each having one or more disulfide linkages in an amount of 1 to 20 parts by weight per 100 parts by weight of the total amount of the compounds (A) and (B). The curable composition little causes viscosity increase in prepolymerization or deaeration, and can be therefore cast-polymerized by easy operation into optical elements and so on.

Inventors:

KAMURA TERUO (JP)
TAKEUCHI MOTOHARU (JP)
JOHNO MASAHIRO (JP)

Application Number:

PCT/JP2006/309907

Publication Date:

November 23, 2006

Filing Date:

May 18, 2006

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)
KAMURA TERUO (JP)
TAKEUCHI MOTOHARU (JP)
JOHNO MASAHIRO (JP)

International Classes:

C08G75/08; G02B1/04; G02C7/02

Domestic Patent References:

WO2004005374A1

2004-01-15

Foreign References:

JP2005121679A	2005-05-12
JP2004339329A	2004-12-02
JP2004315556A	2004-11-11
JP2004269673A	2004-09-30
JP2004197005A	2004-07-15

Other References: