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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/020560
Kind Code:
A1
Abstract:
Provided is a curable composition that can be used as a sealing material or an adhesive agent, etc., has excellent curing properties, and has excellent tensile properties in the cured product. In order to achieve the above objectives, the curable composition comprises a reactive silicon group-containing polyether polymer (A) with a highly-active reactive silicon group (e.g., (ClCH2) (CH3O)2Si -, (CH3OCH2) (CH3O)2Si -, CH3(CH3O)2Si - CH2 - NH - C (=0) -, etc.), a reactive silicon group-containing polyether polymer (B) with a different reactive silicon group (e.g., CH3(CH3O)2Si -, (CH3O)3Si -, etc.), and/or a (meth)acrylic polymer (C) containing a reactive silicon group that is not particularly limited.

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Inventors:
MIYAFUJI KIYOSHI (JP)
FUJIMOTO TOYOHISA (JP)
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2011/004464
Publication Date:
February 16, 2012
Filing Date:
August 05, 2011
Export Citation:
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Assignee:
KANEKA CORP (JP)
MIYAFUJI KIYOSHI (JP)
FUJIMOTO TOYOHISA (JP)
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L71/02; C08G65/336; C08L33/04; C09J171/02; C09K3/10
Domestic Patent References:
WO2008053875A12008-05-08
WO2009133811A12009-11-05
WO2008053875A12008-05-08
WO1997005201A11997-02-13
WO2010004948A12010-01-14
Foreign References:
JP2008239809A2008-10-09
JP2010150381A2010-07-08
JPH08134203A1996-05-28
JP2009529581A2009-08-20
JP2008163141A2008-07-17
JP2005501146A2005-01-13
JP2003500378A2003-01-07
JPH11130931A1999-05-18
JP2001040037A2001-02-13
JPS57502171A1982-12-09
JPS596207A1984-01-13
JP2001207157A2001-07-31
JP2000154368A2000-06-06
JP2001164237A2001-06-19
JPH02129262A1990-05-17
JPH048788A1992-01-13
JPH04173867A1992-06-22
JPH051225A1993-01-08
JPH07113073A1995-05-02
JPH0953063A1997-02-25
JPH10251618A1998-09-22
JPH05117521A1993-05-14
JPH11241029A1999-09-07
JPH07258534A1995-10-09
JPH06279693A1994-10-04
JPH04283259A1992-10-08
JPH09194731A1997-07-29
JPH0570531A1993-03-23
JPH0469659B21992-11-06
JPH07108928B21995-11-22
JPS63254149A1988-10-20
JPS6422904A1989-01-25
JP2001072854A2001-03-21
JP2007513203A2007-05-24
Other References:
J. AM. CHEM. SOC., vol. 116, 1994, pages 7943
MACROMOLECULES, vol. 32, 1999, pages 2872
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
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Claims:



 
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