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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/117902
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable composition with which initial adhesion is realized early, adhesive strength is high, and adhesion is long-lasting, and which is useful as a contact-type of adhesive. The purpose is realized by using a curable composition containing an organic polymer (Q) having reactive silicon groups and a linear organic polymer (P) having a higher number-average molecular weight than (Q) and, at one terminal only, reactive silicon groups formed from three hydrolysable groups at a ratio of (P):(Q) = 60:40 to 5:95 (parts by weight).

Inventors:
FUJIMOTO TOYOHISA (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2012/054181
Publication Date:
September 07, 2012
Filing Date:
February 22, 2012
Export Citation:
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Assignee:
KANEKA CORP (JP)
FUJIMOTO TOYOHISA (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L101/10; C08K5/17; C08K5/57; C08L71/02; C09J171/02; C09J201/10
Domestic Patent References:
WO2009011329A12009-01-22
WO2007040143A12007-04-12
Foreign References:
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Other References:
See also references of EP 2682432A4
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
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Claims:



 
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