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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/047823
Kind Code:
A1
Abstract:
The present invention provides a curable composition capable of curing in a short time and having excellent adhesion properties. This curable composition is characterized by containing: a polyoxyalkylene polymer (A) containing a trimethoxysilyl group; a (meth)acrylate polymer (B) containing a hydrolyzable silyl group; and a silanol condensation catalyst. Such a curable composition is capable of quickly curing because of moisture in the air and/or moisture contained in the article subjected to deposition thereof, and forming a cured article having excellent adhesion properties to various substrates.

Inventors:
MURAYAMA YUKIHIKO (JP)
Application Number:
PCT/JP2012/075220
Publication Date:
April 04, 2013
Filing Date:
September 28, 2012
Export Citation:
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Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C08L71/02; C08F8/42; C08F20/18; C08K5/544; C08L33/06; C09J11/04; C09J133/14; C09J171/02; C09J183/02; C09K3/10
Domestic Patent References:
WO2006112340A12006-10-26
WO2007094275A12007-08-23
WO2007094276A12007-08-23
WO2012056850A12012-05-03
Foreign References:
JP2006291021A2006-10-26
JP2009024107A2009-02-05
JP2008044975A2008-02-28
JPH0912887A1997-01-14
JP2003128942A2003-05-08
JP2002155200A2002-05-28
JP2005082750A2005-03-31
JP2002350644A2002-12-04
JP2012111792A2012-06-14
JP2012107103A2012-06-07
JP2012001614A2012-01-05
Attorney, Agent or Firm:
YAMAMOTO TAKUYA (JP)
Takuya Yamamoto (JP)
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Claims: