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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/080383
Kind Code:
A1
Abstract:
The objective of the present invention is to improve the curing properties of a curable composition. The curable composition according to one aspect of the present invention contains inorganic fine particles (A), a polymerizable compound (B) and a polymerization initiator (C), wherein the polymerizable compound (B) includes a compound (B1), said compound (B1) having , within the same molecule, at least two groups independently selected from (meth)acryloyl groups (K1) and unsaturated hydrocarbon groups (K2). The mean value of the transmittance at a wavelength of 400 to 700 nm of a film formed from the curable composition is 90% or more for a film thickness of 1.0 μm.

Inventors:
MATSUYAMA AYAKA (JP)
INOUE KATSUHARU (JP)
KAWANISHI YUTAKA (JP)
Application Number:
PCT/JP2021/037772
Publication Date:
April 21, 2022
Filing Date:
October 12, 2021
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F20/20; C08F2/44
Domestic Patent References:
WO2015111664A12015-07-30
WO2020189707A12020-09-24
WO2019017196A12019-01-24
Foreign References:
KR20200043202A2020-04-27
JP2009092958A2009-04-30
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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