Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/055082
Kind Code:
A1
Abstract:
The present application relates to a resin composition and uses thereof. The present application may provide a resin composition that exhibits low adhesive strength to a predetermined adherend even while exhibiting high thermal conductivity, or a cured product thereof. In addition, in the present application, the low adhesive strength may be achieved without using a component for adjusting adhesive strength such as a plasticizing agent, or in a state in which a use ratio thereof is minimized. The present application may also provide uses of the resin composition or the cured product thereof.
Inventors:
LEE JEONG HYUN (KR)
KANG YANG GU (KR)
KIM DO YEON (KR)
KANG YANG GU (KR)
KIM DO YEON (KR)
Application Number:
PCT/KR2022/014582
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G18/42; C08G18/10; C08G18/48; C08G18/72; C08K3/013; C08L75/04
Foreign References:
| KR20190106367A | 2019-09-18 | |||
| JP2009167383A | 2009-07-30 | |||
| KR20100019442A | 2010-02-18 | |||
| KR20160145532A | 2016-12-20 | |||
| KR20160105354A | 2016-09-06 |
Other References:
ZORAN S. PETROVIC, IVANA CVETKOVIC, DOOPYO HONG, XIANMEI WAN, WEI ZHANG, TIM ABRAHAM, JEFF MALSAM: "Polyester Polyols and Polyurethanes from Ricinoleic Acid", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY & SONS, INC., US, vol. 108, 15 April 2008 (2008-04-15), US , pages 1184 - 1190, XP002623190, ISSN: 0021-8995, DOI: 10.1002/APP.27783
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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