Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/167067
Kind Code:
A1
Abstract:
The present disclosure provides a curable composition containing an ene compound and a thiol compound. A cured product of this curable composition has good adhesiveness and the adhesive strength of the cured product tends not to diminish. The curable composition relating to this disclosure contains an ene compound (A) and a thiol compound (B). The thiol compound (B) contains a compound (B1) that has thioether groups and has a thiol group equivalent of 100 or greater.
Inventors:
WAKAIKI TAKAHIRO
SHINOZAKI HIROKI
SHINOZAKI HIROKI
Application Number:
PCT/JP2023/006424
Publication Date:
September 07, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G75/045; C08L81/00; C09J11/04; C09J11/06; C09J11/08; C09J181/02
Domestic Patent References:
| WO2016117385A1 | 2016-07-28 | |||
| WO2018181421A1 | 2018-10-04 | |||
| WO2014069027A1 | 2014-05-08 | |||
| WO2019225377A1 | 2019-11-28 |
Foreign References:
| JP2017052904A | 2017-03-16 | |||
| JP2017052905A | 2017-03-16 | |||
| JP2017052934A | 2017-03-16 | |||
| JP2016204401A | 2016-12-08 | |||
| JP2016117833A | 2016-06-30 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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