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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/229395
Kind Code:
A1
Abstract:
The present application can provide a curable composition and use thereof, the curable composition exhibiting low density so as to be light weight, and suppressing viscosity change over time so as to have excellent stability when kept or stored. In addition, the curable composition exhibits excellent mixability when being prepared, and can form a cured product having high thermal conductivity, low specific gravity (density), and relatively high hardness if cured. Furthermore, the present application can provide a device including the curable composition or the cured product thereof.

Inventors:
JUNG JE SIK (KR)
HONG SUNG BUM (KR)
LEE SOL YI (KR)
SEO SANG HYUK (KR)
KIM HYE JIN (KR)
Application Number:
PCT/KR2023/007174
Publication Date:
November 30, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G18/72; C08G18/42; C08K3/013; C08K3/22; C08K5/00; H01M10/653
Foreign References:
KR20150064064A2015-06-10
KR20220043762A2022-04-05
JP2022503939A2022-01-12
JP6990999B22022-01-12
KR20200115433A2020-10-07
KR20230046974A2023-04-06
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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