Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/095521
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a curable composition which can be cured under low temperature conditions and a cured product of which has improved heat resistance; a cured product obtained by curing same; a curing agent for resole-type phenolic resin; and a curable composition-containing adhesive. To solve the problem, provided is a curable composition containing the following component (A) and the following component (B). Component (A) is a resole-type phenolic resin. Component (B) is a composition comprising a component (B1) composed of compound (1), compound (2), and compound (3), wherein the total amount of component (B1) falls within the range of 40 area% to 70 area% of the total amount of all components detected by gel permeation chromatography using a differential refractometer.
Inventors:
YAMAGISHI TADA-AKI (JP)
KAKUTA TAKAHIRO (JP)
KAWAMOTO RIKU (JP)
YOKOURA TADAFUMI (JP)
MIYAGAWA KEITARO (JP)
KAKUTA TAKAHIRO (JP)
KAWAMOTO RIKU (JP)
YOKOURA TADAFUMI (JP)
MIYAGAWA KEITARO (JP)
Application Number:
PCT/JP2023/021900
Publication Date:
May 10, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
HONSHU CHEMICAL IND CO LTD (JP)
International Classes:
C08L61/08; C08K5/13; C09J11/06; C09J161/08
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (2-21-2 Kanda-Misakicho Chiyoda-k, Tokyo 61, JP)
Download PDF:
Previous Patent: TOILET PAPER AND TOILET PAPER MANUFACTURING METHOD
Next Patent: PNEUMATIC TIRE AND MANUFACTURING METHOD THEREFOR
Next Patent: PNEUMATIC TIRE AND MANUFACTURING METHOD THEREFOR