Title:
CURABLE COMPOUND PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/133984
Kind Code:
A1
Abstract:
The present invention provides a curable compound product that forms a cured product having excellent heat resistance and high insulating properties by performing heat treatment. The curable compound product of the present disclosure contains a compound represented by Formula (1) below, and a proportion of a group represented by Formula (r-1) below to the sum of the group represented by Formula (r-1) below and a group represented by Formula (r-2) below is 97%or greater. In Formula (1), R 1 and R 2 are identical or different, and each represent the group represented by Formula (r-1) the group represented by Formula (r-2) below: D 1 and D 2 are identical or different, and each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below.
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Inventors:
LIU FENG (CN)
OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)
OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)
Application Number:
PCT/CN2020/139307
Publication Date:
June 30, 2022
Filing Date:
December 25, 2020
Export Citation:
Assignee:
DAICEL CORP (JP)
LIU FENG (CN)
LIU FENG (CN)
International Classes:
C08G65/40; C08G65/48; C08G73/12
Domestic Patent References:
| WO2019244694A1 | 2019-12-26 | |||
| WO2019244694A1 | 2019-12-26 |
Foreign References:
| JP2019218659A | 2019-12-26 | |||
| JP2019217048A | 2019-12-26 | |||
| JP2000219741A | 2000-08-08 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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