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Title:
CURABLE CONDUCTIVE ORGANOPOLYSILOXANE COMPOSITION AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/143890
Kind Code:
A1
Abstract:
The present invention relates to a method for preparing a curable conductive organopolysiloxane composition especially having high content of conductive filler and a curable conductive organopolysiloxane composition preferably obtained therefrom and a premixed conductive paste. The present invention also relates to a cured conductive silicone rubber obtained by such curable conductive organopolysiloxane composition as well as the use thereof, especially in electromagnetic shielding. The present invention further relates to an electrical wires and cables comprising such cured conductive silicone rubber. A higher content of conductive fillers could be loaded while enabling good processability by initially preparing a premixed conductive paste comprising an organopolysiloxane with specific dynamic viscosity and at least a portion of the conductive fillers, and then mixing the premixed conductive paste with the organopolysiloxane masterbatch comprising at least one organopolysiloxane A and optionally at least one reinforcing filler to obtain a mixture.

Inventors:
CAI TIAN (CN)
YANG LONG (CN)
JIANG XIN (CN)
Application Number:
PCT/CN2021/143041
Publication Date:
July 07, 2022
Filing Date:
December 30, 2021
Export Citation:
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Assignee:
ELKEM SILICONES SHANGHAI CO LTD (CN)
International Classes:
C08L83/04; C08J3/22; C08K3/04
Domestic Patent References:
WO2017114440A12017-07-06
WO2020061988A12020-04-02
Foreign References:
KR20180091385A2018-08-16
US5725922A1998-03-10
CN102134399A2011-07-27
CN111607232A2020-09-01
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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