Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/109212
Kind Code:
A1
Abstract:
Provided is a curable epoxy resin composition capable of forming a cured product which exhibits excellent transparency, heat resistance, thermal-shock resistance, and adhesion properties. A curable epoxy resin composition containing an alicyclic epoxy compound (A) and an acrylic resin (B), the curable epoxy resin composition being characterized in that the acrylic resin (B) contains an acrylic monomer and a styrene monomer as essential monomer components, and is a polymer having an epoxy group in the side chain thereof. It is preferable for the curable epoxy resin composition to contain the alicyclic epoxy compound (A) in the amount of 65-95 wt% and the acrylic resin (B) in the amount of 5-35 wt%, given that the alicyclic epoxy compound (A) and the acrylic resin (B) are equivalent to 100 wt% in total.
Inventors:
SUZUKI HIROSE (JP)
TAKABAYASHI NAOFUMI (JP)
TAKABAYASHI NAOFUMI (JP)
Application Number:
PCT/JP2013/084278
Publication Date:
July 17, 2014
Filing Date:
December 20, 2013
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08L63/00; C08G59/24; C08L33/14; C09J11/06; C09J133/14; C09J163/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2012165413A1 | 2012-12-06 | |||
| WO2012086463A1 | 2012-06-28 | |||
| WO2013002052A1 | 2013-01-03 |
Foreign References:
| JPH05125150A | 1993-05-21 | |||
| JPH10310681A | 1998-11-24 | |||
| JP2007231091A | 2007-09-13 | |||
| JP2006057078A | 2006-03-02 | |||
| JPH01158088A | 1989-06-21 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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