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Title:
CURABLE FILM ADHESIVE AND METHOD OF MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022485
Kind Code:
A1
Abstract:
The present invention provides: a curable film adhesive which is used for a member that composes a sensor device and which includes a compound having a cyclic ether group, a polymer component, and a curing agent containing an imidazole compound having a reaction activation temperature of 125°C or lower and a thermal cationic polymerization initiator having a reaction activation temperature of 160°C or lower; and a method of manufacturing a device that includes a step of adhering the curable film adhesive to a member including a module and curing the curable film adhesive by heating the same to a temperature in the range of 80 to 110°C. Thus, it is possible to provide: a curable film adhesive which is used for a member that composes a sensor device and which is capable of being cured at a low temperature and of providing a cured product having excellent transparency; and a method of manufacturing a device that uses the curable film adhesive which is capable of being cured at a low temperature and of providing a cured product having excellent transparency.

Inventors:
HASEGAWA TATSUKI (JP)
NISHIJIMA KENTA (JP)
KOMIYAMA MIKIO (JP)
Application Number:
PCT/JP2019/029444
Publication Date:
January 30, 2020
Filing Date:
July 26, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/06; C09J11/06; C09J123/00; C09J123/26
Domestic Patent References:
WO2016158760A12016-10-06
WO2017094591A12017-06-08
WO2012114921A12012-08-30
WO2017043405A12017-03-16
Foreign References:
JP2018046038A2018-03-22
JP2008074969A2008-04-03
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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