CURABLE FLUORINATED RESIN COMPOSITION

WIPO Patent Application WO/2011/096370

A1

Disclosed is a curable fluorinated resin composition that exhibits superior heat stability and thermal adhesion characteristics. Specifically disclosed is a curable fluorinated resin composition comprising a thiol compound (S) and a fluoropolymer (P) that has a polymerizable double bond, said curable fluorinated resin composition being characterized in that the fluoropolymer (P) is a copolymer which has a repeating unit derived from fluoromonoene (a) and a repeating unit derived from fluorodiene (b) that has a residual unsaturated side chain, and in that the resin composition includes 0.01-1.00 parts by mass of the thiol compound (S) per 100 parts by mass of the fluoropolymer (P).

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SUGIYAMA NORIHIDE (JP)
MATSUURA KEIGO (JP)

PCT/JP2011/051955

August 11, 2011

January 31, 2011

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ASAHI GLASS CO LTD (JP)
SUGIYAMA NORIHIDE (JP)
MATSUURA KEIGO (JP)

C08L27/12; C07C323/03; C08F214/18; C08F216/12; C08G75/04; C08G75/045; C08K5/37; C08L29/10; G02B1/04; H01L33/56

WO2007145181A1	2007-12-21
WO2009096342A1	2009-08-06
WO2005085303A1	2005-09-15

US2961470A	1960-11-22
JP2008195929A	2008-08-28
JP2010024702A	2010-02-04

J. FLUORINE CHEMISTRY, vol. 36, 1987, pages 449

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

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