Title:
CURABLE HOT MELT ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF AND METHOD FOR PRODUCING FILM, ETC. COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/042743
Kind Code:
A1
Abstract:
[Problem] To provide a hot-melt silicone composition that can be cured at various temperatures, enables wide range design of adhesion strength of a resulting cured product to a substrate, and has excellent transparency, high yellowing resistance and excellent handling properties, and use of the composition. [Solution] A curable hot-melt organopolysiloxane composition containing (A) 1-50 parts by mass of a chain-form organopolysiloxane having two or more alkenyl groups per molecule, (B) 50-99 parts by mass of an MQ-type organopolysiloxane resin having a mass ratio of M unit to 1 mole of Q unit within the range of 0.5-2.0, and (C) 0.1-10 parts by mass of a radical polymerization initiator, optionally together with (D) 0-50 parts by mass of another radical reactive component, wherein the content of component (B) is 50 mass% or more relative to the total mass of the solid content of the composition, and use of the composition.
Inventors:
YOKOUCHI YUKI (JP)
IIMURA TOMOHIRO (JP)
IIMURA TOMOHIRO (JP)
Application Number:
PCT/JP2022/033707
Publication Date:
March 23, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08F283/12; B32B7/06; B32B27/00; C08F2/44; C08F2/50; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021124724A1 | 2021-06-24 |
Foreign References:
| JP2021045953A | 2021-03-25 | |||
| JP2021108319A | 2021-07-29 | |||
| JP2005053966A | 2005-03-03 | |||
| JPH0286678A | 1990-03-27 | |||
| JP2020523422A | 2020-08-06 | |||
| JP2016124967A | 2016-07-11 |
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