Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084897
Kind Code:
A1
Abstract:
This invention provides a curable organopolysiloxane composition that gives a cured product free from the occurrence of cracks or voids during curing, wherein a necessary and sufficient amount of a material excellent in thermal conductivity is mixed, and the material is dispersed uniformly in a matrix including a resin component in a microparticle state. Provided is a curable organopolysiloxane composition comprising (A) an organopolysiloxane being in a liquid state at 25°C and having, in one molecule, two or more alkenyl groups bonded to a silicon atom, (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom, (C) one or more selected from the group consisting of a gallium alloy and gallium having a melting point of -20 to 70°C, (D) a thermally conductive filler having an average particle diameter of 0.1 to 30 μm, and (E) a platinum group metal catalyst, wherein the gallium and/or the gallium alloy of (C) is dispersed in the organopolysiloxane in a microparticle state, and the solidifying point of the gallium and/or the gallium alloy is thereby -40°C or lower.
Inventors:
YAMADA KUNIHIRO (JP)
KUBONO TOKO (JP)
TSUJI KENICHI (JP)
KUBONO TOKO (JP)
TSUJI KENICHI (JP)
Application Number:
PCT/JP2023/034513
Publication Date:
April 25, 2024
Filing Date:
September 22, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/013; C08K3/105; C08L83/05; C09K5/14; H01L23/36; H01L23/373
Domestic Patent References:
| WO2020129555A1 | 2020-06-25 | |||
| WO2020203299A1 | 2020-10-08 |
Foreign References:
| JP2005112961A | 2005-04-28 | |||
| JP2011144234A | 2011-07-28 | |||
| JP2010018662A | 2010-01-28 | |||
| JP2013010862A | 2013-01-17 | |||
| JP2015078296A | 2015-04-23 |
Attorney, Agent or Firm:
USHIKI & ASSOCIATES (JP)
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