Title:
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, METAL-CLAD LAMINATE AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/210562
Kind Code:
A1
Abstract:
The present disclosure provides a curable polymer which enables the achievement of a resin that is effectively reduced in the dielectric loss tangent (Df) under high frequency conditions, while having a sufficiently high glass transition temperature (Tg). The present disclosure provides a curable polymer which is a copolymer that has one or more structural units (UX) represented by the formula and one or more other structural units. The present disclosure also provides a curable polymer which is a copolymer or a homopolymer that only contains one or more structural units (UX) represented by the formula, the curable polymer being used for the production of a prepreg, a metal-clad laminate or a wiring board. (In the formula, each of R1 and R2 independently represents a hydrogen atom, a hydroxyl group of an organic group; a benzene ring may have a substituent other than the above-described groups; and n represents an integer of 0 or more.)
Inventors:
HASHIMOTO KAZUMI (JP)
USUDA TSUKASA (JP)
NOMURA YOSHITAKA (JP)
MATSUNAMI ASUKA (JP)
USUDA TSUKASA (JP)
NOMURA YOSHITAKA (JP)
MATSUNAMI ASUKA (JP)
Application Number:
PCT/JP2023/016058
Publication Date:
November 02, 2023
Filing Date:
April 24, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08F30/08; B32B15/08; C08F299/00; H05K1/03
Foreign References:
| JPS62263214A | 1987-11-16 | |||
| JPS6088015A | 1985-05-17 | |||
| JPH05220362A | 1993-08-31 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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