Title:
CURABLE POLYMERIC COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO2001057094
Kind Code:
A3
Abstract:
Radiation-curable resins as well as thermal, oxidative and electron-beam-curable resins are provided comprising a polymeric backbone having substituents with a reactive-unsaturation and varying numbers and types of carboxyl moieties. These resins have enhanced adhesion properties to a variety of different substrates including glass, plastics and metals. Acidic synergists such as half esters of dibasic acids or cyclic anhydrides that also contain a reactive unsaturation may also be added to the resin to expand the levels of acidity present in the resin and expand the range of substrates that may be used. The cured resins are protected against water, chemical and solvent attack.
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Inventors:
ESTRIN TANYA
Application Number:
PCT/EP2001/001373
Publication Date:
February 21, 2002
Filing Date:
February 07, 2001
Export Citation:
Assignee:
SARTOMER CO INC (US)
CRAY VALLEY SA (FR)
CRAY VALLEY SA (FR)
International Classes:
C08F8/30; C08F8/34; C08F290/12; C08F8/40; C08F8/46; C08F279/02; C09D5/00; C09D109/00; C09D151/04; C09D201/00; C09J4/06; C09J109/00; C09J151/04; C09J201/00; (IPC1-7): C09J4/06; C09D4/06
Domestic Patent References:
| WO1998022545A1 | 1998-05-28 |
Foreign References:
| EP0425085A1 | 1991-05-02 | |||
| EP0456380A2 | 1991-11-13 | |||
| EP0465670A1 | 1992-01-15 | |||
| EP0679663A2 | 1995-11-02 |
Other References:
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DATABASE WPI Section Ch Week 197819, Derwent World Patents Index; Class A12, AN 1978-34065A, XP002171435
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DATABASE WPI Section Ch Week 197819, Derwent World Patents Index; Class A12, AN 1978-34065A, XP002171435
DATABASE WPI Section Ch Week 197946, Derwent World Patents Index; Class A12, AN 1979-83288B, XP002171436
PATENT ABSTRACTS OF JAPAN vol. 005, no. 195 (C - 083) 11 December 1981 (1981-12-11)
DATABASE WPI Section Ch Week 198451, Derwent World Patents Index; Class A14, AN 1984-315367, XP002171437
DATABASE WPI Section Ch Week 198831, Derwent World Patents Index; Class A14, AN 1988-215533, XP002171438
PATENT ABSTRACTS OF JAPAN vol. 015, no. 508 (C - 0897) 24 December 1991 (1991-12-24)
PATENT ABSTRACTS OF JAPAN vol. 018, no. 612 (P - 1829) 21 November 1994 (1994-11-21)
CHEMICAL ABSTRACTS, vol. 125, no. 2, 8 July 1996, Columbus, Ohio, US; abstract no. 13443, XP002171433
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