Title:
CURABLE RESIN COMPOSITION, ACTIVE ENERGY RAY CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/185933
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition, an active energy ray curable resin composition containing the curable resin composition, and a cured product and article of said active energy ray curable resin composition, the curable resin composition being characterized by: containing a resin (A) having an acid group and a polymerizable unsaturated group, and a compound (B) having, as essential raw materials, a metal salt (b2) and a compound (b1) having an intramolecular heteroatom that has an unshared electron pair; and the heteroatom being at least one element selected from the group consisting of nitrogen, oxygen, sulfur, and phosphorus. This curable resin composition has excellent work stability and potential, and can form a cured product having excellent heat resistance and substrate adhesion.
Inventors:
YAMADA SHUNSUKE (JP)
NAKANO HIROAKI (JP)
UJIGAWA MARI (JP)
NAKANO HIROAKI (JP)
UJIGAWA MARI (JP)
Application Number:
PCT/JP2022/006296
Publication Date:
September 09, 2022
Filing Date:
February 17, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F299/00; C08F2/44; C08K5/098; C08K5/34
Domestic Patent References:
| WO2018225466A1 | 2018-12-13 |
Foreign References:
| JP2000319623A | 2000-11-21 | |||
| JP2021021017A | 2021-02-18 | |||
| JP2009098412A | 2009-05-07 | |||
| JP2002129347A | 2002-05-09 | |||
| JP2007148371A | 2007-06-14 | |||
| JPH08259663A | 1996-10-08 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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