Title:
PHOTO/MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, AND ADHESIVE FOR DISPLAY ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2019/054463
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a photo/moisture curable resin composition which has excellent storage stability and fast curing properties. Another purpose of the present invention is to provide an adhesive for electronic components and an adhesive for display elements, each of which is obtained using this photo/moisture curable resin composition. The present invention is a photo/moisture curable resin composition which contains a moisture curable urethane resin, a photopolymerizable compound, a photopolymerization initiator, a moisture curing accelerating catalyst, and a stabilizer.
Inventors:
JO KON (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
KIDA TAKUMI (JP)
TAMAGAWA TOMOKAZU (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
KIDA TAKUMI (JP)
TAMAGAWA TOMOKAZU (JP)
Application Number:
PCT/JP2018/034088
Publication Date:
March 21, 2019
Filing Date:
September 14, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G18/30; C08F2/44; C08F2/46; C08G18/18; C09J4/00; C09J11/06; C09J175/04
Domestic Patent References:
| WO1999042525A1 | 1999-08-26 |
Foreign References:
| JP2016199743A | 2016-12-01 | |||
| JP2001348416A | 2001-12-18 | |||
| JP2016199672A | 2016-12-01 | |||
| JP2001064543A | 2001-03-13 | |||
| JP2002179753A | 2002-06-26 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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