PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT

Title:

PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT

Document Type and Number:

WIPO Patent Application WO/2023/153514

Kind Code:

A1

Abstract:

This photo/moisture curable resin composition contains a radical polymerizable compound, a moisture-curable resin, a photoradical polymerization initiator, and zirconium nitride, and the OD value of the cured product having a thickness of 1 mm after curing is at least 2.

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Inventors:

ISHIDATE RYOMA (JP)

Application Number:

PCT/JP2023/004815

Publication Date:

August 17, 2023

Filing Date:

February 13, 2023

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C09J4/00; C08F2/44; C09J11/04; C09J11/06; C09J201/00

Domestic Patent References:

WO2015111570A1	2015-07-30
WO2021230372A1	2021-11-18

Foreign References:

JP2020076794A

2020-05-21

Attorney, Agent or Firm:

TAGUCHI, Masahiro et al. (JP)

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