Title:
CURABLE RESIN COMPOSITION, ELECTRIC/ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/030115
Kind Code:
A1
Abstract:
Provided is a curable resin composition from which a cured article having excellent adhesion to a substrate, particularly a poorly-adhesive resin substrate, can be produced. This curable resin composition comprises (A) a curable resin, (B) an ethylenically unsaturated monomer, (C) an acidic surfactant, (D) an inorganic filler, (E) a thermal polymerization initiator, and optionally a saturated polybasic acid, in which the curable resin (A) comprises at least a vinyl ester resin, the acid value of a mixture of the curable resin (A), the ethylenically unsaturated monomer (B) and the saturated polybasic acid is 12 mgKOH/g or less, the acid value of a mixture of the curable resin (A), the ethylenically unsaturated monomer (B), the acidic surfactant (C) and the saturated polybasic acid is 10 mgKOH/g or more, and the acidic surfactant (C) is a low-volatile substance having an acid value of 20 mgKOH/g or more.
Inventors:
HARADA YUSUKE (JP)
NISHIJIMA DAISUKE (JP)
NISHIJIMA DAISUKE (JP)
Application Number:
PCT/JP2021/023262
Publication Date:
February 10, 2022
Filing Date:
June 18, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F290/06; H02K3/30
Domestic Patent References:
| WO2019198641A1 | 2019-10-17 | |||
| WO2019177013A1 | 2019-09-19 | |||
| WO2020162288A1 | 2020-08-13 |
Foreign References:
| JP2003105210A | 2003-04-09 | |||
| JP2011052130A | 2011-03-17 | |||
| JP2016056367A | 2016-04-21 | |||
| US20140121313A1 | 2014-05-01 | |||
| JP2020132737A | 2020-08-31 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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