Title:
CURABLE RESIN COMPOSITION, ELECTRIC/ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/044507
Kind Code:
A1
Abstract:
Provided is a curable resin composition which can be injection molded and has exceptional yield, and from which it is possible to obtain a cured product having excellent appearance and exceptional adhesion to a substrate, particularly to a hardly adhesive resin substrate. A curable resin composition including a curable resin (A), an ethylenically unsaturated monomer (B), an inorganic filler (C), a heat polymerization initiator (D), glass fibers (E), and a low constrictive agent (F), the curable resin (A) containing at least a vinyl ester resin, the ethylenically unsaturated monomer (B) containing at least an aromatic vinyl compound, the aromatic vinyl compound containing at least an aromatic divinyl compound, and the ratio of the total quantity of vinyl groups in the aromatic vinyl compound to the total quantity of ethylenically unsaturated groups included in the curable resin (A) and the ethylenically unsaturated monomer (B) being 60-95 mol%.
Inventors:
HARADA YUSUKE (JP)
NISHIJIMA DAISUKE (JP)
NISHIJIMA DAISUKE (JP)
Application Number:
PCT/JP2021/023269
Publication Date:
March 03, 2022
Filing Date:
June 18, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B29C45/00; B29C45/02; C08F290/06; C08J5/04
Foreign References:
| JP2005082745A | 2005-03-31 | |||
| JPH02501998A | 1990-07-05 | |||
| JPH02502029A | 1990-07-05 | |||
| JP2018002888A | 2018-01-11 | |||
| JPH08325336A | 1996-12-10 | |||
| JP2004075931A | 2004-03-11 | |||
| JP2020097642A | 2020-06-25 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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