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Patent Searching and Data


Title:
CURABLE RESIN AND CURABLE RESIN COMPOSITION CONTAINING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/070800
Kind Code:
A1
Abstract:
An unsaturated monocarboxylic acid (d) is reacted with a product (c) of the reaction of a compound (a) having one or more phenolic hydroxy groups per molecule with glycidol (b) to obtain a curable resin (e). The curable resin (e) is reacted with a polybasic acid anhydride (f) to obtain a photocurable thermosetting resin (g). Compounding the curable resin (e) and/or photocurable thermosetting resin (g) as a curable ingredient with a photopolymerization initiator, epoxy resin, etc. gives a curable resin composition. This composition is utilizable in a wide range of applications such as an adhesive, coating material, solder resist or etching resist for use in producing printed wiring boards, interlayer dielectric for built-up substrates, plating resist, dry film, and color filter member.

Inventors:
KOHIYAMA NOBORU (JP)
USHIKI SHIGERU (JP)
OZAWA SATOSHI (JP)
KAMAYACHI YUICHI (JP)
Application Number:
PCT/JP2003/001495
Publication Date:
August 28, 2003
Filing Date:
February 13, 2003
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
KOHIYAMA NOBORU (JP)
USHIKI SHIGERU (JP)
OZAWA SATOSHI (JP)
KAMAYACHI YUICHI (JP)
International Classes:
C08F290/06; C08G8/28; C08G59/42; H05K3/00; H05K3/28; (IPC1-7): C08G8/30; C07C69/54; C08F299/02; C08G8/32; C08G59/40
Foreign References:
JP2000336144A2000-12-05
JPH04136018A1992-05-11
JPS63289014A1988-11-25
JPS61243869A1986-10-30
JPH0297513A1990-04-10
JPH1090887A1998-04-10
JPS56123939A1981-09-29
JPS3916276B11964-08-10
JP2003076009A2003-03-14
JP2002138125A2002-05-14
JPS5088198A1975-07-15
JPH026517A1990-01-10
JPH0192281A1989-04-11
Attorney, Agent or Firm:
Yoshida, Shigeki (Harada Bldg. 14-2, Takadanobaba 2-chom, Shinjuku-ku Tokyo, JP)
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