Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/145108
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a curable resin composition capable of providing excellent solubility in solvents, excellent heat resistance (a high glass transition temperature) and excellent dielectric properties (low dielectric properties); and a cured product of the curable resin composition. More specifically provided is a curable resin composition characterized by comprising a curable resin (A) having a repeating unit represented by general formula (1) and also having at least one reactive group selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group and an acryl ether group as a terminal structure and a curable compound (B) represented by general formula (2). (Details of the substituents and the number of substituents in general formula (1) are as mentioned in the description.) (Details of the substituents and the number of substituents in general formula (2) are as mentioned in the description.)
Inventors:
MATSUOKA RYUICHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
Application Number:
PCT/JP2022/029053
Publication Date:
August 03, 2023
Filing Date:
July 28, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F290/06; C08G63/21
Domestic Patent References:
| WO2020189598A1 | 2020-09-24 | |||
| WO2020008879A1 | 2020-01-09 |
Foreign References:
| JPS58157844A | 1983-09-20 | |||
| JP2020158658A | 2020-10-01 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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