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Title:
CURABLE RESIN COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2023/058602
Kind Code:
A1
Abstract:
A curable resin composition comprising: a prepolymer (A) having a reactive silyl group bound to carbon at α-position; and a photoacid generator (B).

Inventors:
KIM CHIZURU (JP)
SUEZAKI MINORU (JP)
Application Number:
PCT/JP2022/036988
Publication Date:
April 13, 2023
Filing Date:
October 03, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G18/10; C08L101/10; C08G18/28; C08G18/83; C08K5/00; C09J183/00
Domestic Patent References:
WO2020094453A12020-05-14
WO2012133443A12012-10-04
Foreign References:
US20190194509A12019-06-27
US20200048394A12020-02-13
JP2015518500A2015-07-02
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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