Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2023/085280
Kind Code:
A1
Abstract:
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).

More Like This:
JP6161103A manufacturing method of a hardenability constituent
JP2005290269CURABLE COMPOSITION, SEALING MATERIAL AND ADHESIVE
WO/2007/072189A SILYLATED POLYMER EMULSION AND ITS PREPARATION METHOD AND USES THEREOF
Inventors:
KIM CHIZURU (JP)
SUEZAKI MINORU (JP)
Application Number:
PCT/JP2022/041594
Publication Date:
May 19, 2023
Filing Date:
November 08, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/10; C08K3/013; C08K5/00; C08K5/1515; C08K5/5435; C08L63/00; C08L71/00; C09J11/04; C09J11/06; C09J11/08; C09J163/00; C09J171/00; C09J201/10; C09K3/10
Foreign References:
JP2018062590A2018-04-19
JP2012144693A2012-08-02
JP2012233135A2012-11-29
JP2012233134A2012-11-29
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INFORMATION PROCESSING SYSTEM, AND INFORMATION PROCESSING METHOD

Next Patent: ADHESIVE AND ADHESIVE TAPE