Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYIMIDE, POLY BENZOOXAZOLE, POLYIMIDE PRECURSOR, OR POLY BENZOOXAZOLE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2020/255825
Kind Code:
A1
Abstract:
A curable resin composition including a specified resin, a polymerization initiator, and a polymerizable compound, said resin including a structure indicated by formula (1–1); a cured film formed by curing the curable resin composition; a laminate including the cured film; a production method for the cured film; a semiconductor device including the cured film or the laminate; and a novel polyimide, poly benzooxazole, polyimide precursor, or poly benzooxazole precursor.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2020/022855
Publication Date:
December 24, 2020
Filing Date:
June 10, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/06; C08G59/20; C08G73/12; C08G73/22; G03F7/027; G03F7/40
Domestic Patent References:
| WO2017056595A1 | 2017-04-06 | |||
| WO2017175598A1 | 2017-10-12 |
Foreign References:
| JPH05119323A | 1993-05-18 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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