Title:
CURABLE RESIN COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM
Document Type and Number:
WIPO Patent Application WO/2021/045453
Kind Code:
A1
Abstract:
The present invention relates to a curable resin composition comprising (A) a silicon-based polymer, (B) particles including a compound having an N-aryl amino group on the surface thereof, and (C) a solvent.
Inventors:
LEE SEUNGEUN (KR)
SHIN DONGJU (KR)
KIM JI YOON (KR)
RYU JEEHYUN (KR)
SO MINJI (KR)
SHIN DONGJU (KR)
KIM JI YOON (KR)
RYU JEEHYUN (KR)
SO MINJI (KR)
Application Number:
PCT/KR2020/011554
Publication Date:
March 11, 2021
Filing Date:
August 28, 2020
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C08K9/04; C08G77/26; C08K3/36; C08K5/18; C08K7/24; C08L83/08
Foreign References:
| KR100882794B1 | 2009-02-09 | |||
| US20130344338A1 | 2013-12-26 | |||
| KR100955570B1 | 2010-04-30 | |||
| KR20150143573A | 2015-12-23 | |||
| KR20140065250A | 2014-05-29 | |||
| KR20090043397A | 2009-05-06 |
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
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