CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE

Title:

CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/235469

Kind Code:

A1

Abstract:

This curable resin composition contains: at least one type of resin selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, polyamide-imide, and polyamide-imide precursors; a compound B having at least one group selected from an N-hydroxyamino group, an N-hydroxyimino group, an N-hydroxyamide group and an N-hydroxyimide group; and an organometallic complex.

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Inventors:

ASAKAWA DAISUKE (JP)

Application Number:

PCT/JP2021/018920

Publication Date:

November 25, 2021

Filing Date:

May 19, 2021

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C08F290/14; C08F2/50; C08F4/76; C08G73/10; C08G73/14; C08G73/22; C08K5/00; C08K5/21; C08K5/32; C08K5/33; G03F7/004; G03F7/027; G03F7/037

Domestic Patent References:

WO2018025738A1	2018-02-08
WO2011142363A1	2011-11-17
WO2017170600A1	2017-10-05

Foreign References:

JP2019185031A	2019-10-24
JP2012194520A	2012-10-11
JPH075688A	1995-01-10

Attorney, Agent or Firm:

SIKS & CO. (JP)

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