Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMOSETTING RESIN
Document Type and Number:
WIPO Patent Application WO/2021/261429
Kind Code:
A1
Abstract:
Provided are: a thermosetting resin having a polymerizable group and isoimide structure; a curable resin composition containing a radiation-sensitive polymerization initiator, a cured film formed by curing said curable resin composition, a laminate containing said cured film, and a method for producing said cured film; a semiconductor device containing said cured film or said laminate; and a thermosetting resin having a specific structure.
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Inventors:
YAMAGUCHI SHUHEI (JP)
Application Number:
PCT/JP2021/023352
Publication Date:
December 30, 2021
Filing Date:
June 21, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F299/02; C08G73/10; G03F7/027; G03F7/40
Foreign References:
| JP2001100409A | 2001-04-13 | |||
| JP2003248309A | 2003-09-05 | |||
| JPS62145239A | 1987-06-29 | |||
| JPH0415226A | 1992-01-20 | |||
| JP2001125266A | 2001-05-11 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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