Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE
Document Type and Number:
WIPO Patent Application WO/2023/120627
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a curable resin composition in which film cracking does not readily occur at high temperatures in a nitrogen atmosphere even with a thick film; a cured film in which the curable resin composition is used; a laminate comprising the cured film; an imaging device and semiconductor device comprising the laminate; and a method for manufacturing the laminate and a method for manufacturing an element having a contact electrode used in manufacturing the laminate. The present invention is a curable resin compound containing a polyimide and a silsesquioxane, wherein the polyimide content is 0.5-50 parts by weight with respect to 100 parts by weight of the silsesquioxane.
Inventors:
NOMOTO HAYATE (JP)
SHIOJIMA TARO (JP)
SHICHIRI TOKUSHIGE (JP)
SATO KENICHIRO (JP)
DEGUCHI HIDENOBU (JP)
SHIOJIMA TARO (JP)
SHICHIRI TOKUSHIGE (JP)
SATO KENICHIRO (JP)
DEGUCHI HIDENOBU (JP)
Application Number:
PCT/JP2022/047305
Publication Date:
June 29, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L83/04; B32B15/08; B32B27/00; C08G73/10; C08G77/14; C08L79/08
Foreign References:
| JP2013018806A | 2013-01-31 | |||
| JP2003003066A | 2003-01-08 | |||
| JP2005105011A | 2005-04-21 | |||
| JP2006191081A | 2006-07-20 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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