Title:
CURABLE RESIN COMPOSITION, RESIN CURED FILM, PARTITION WALL AND OPTICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/149406
Kind Code:
A1
Abstract:
The present invention relates to a curable resin composition which contains a multifunctional thiol compound. The multifunctional thiol compound is (1) a compound which does not have a CH structure next but one to an S atom, or (2) a compound which is obtained by adding ethylene to all SH groups in the multifunctional thiol compound, wherein the electrical charge of a hydrogen atom which is bonded to a carbon atom that is next but one to an S atom is 0.265 or less as determined by means of natural population analysis after structural optimization based on density functional approach.
Inventors:
YAMADA KOTARO (JP)
MIENO HIROYUKI (JP)
SHIROTA NAOKO (JP)
MIENO HIROYUKI (JP)
SHIROTA NAOKO (JP)
Application Number:
PCT/JP2023/002938
Publication Date:
August 10, 2023
Filing Date:
January 30, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08G75/045; C08F2/38; C08F290/06; G03F7/004; G03F7/027
Domestic Patent References:
| WO2016031574A1 | 2016-03-03 |
Foreign References:
| JP2011084479A | 2011-04-28 | |||
| JP2021047388A | 2021-03-25 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
Download PDF: