Title:
CURABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2006/129663
Kind Code:
A1
Abstract:
A curable resin composition which contains an inorganic filler in a high concentration. It can easily attain a reduced coefficient of thermal expansion, increased coefficient of thermal conductivity, reduced water absorption, etc. The composition can be developed with a dilute aqueous alkali solution. It is reduced in the content of gasifiable components to be released at high temperatures from organic ingredients including the resin. The resin composition is an alkali-developable insulating resin composition comprising (A) a carboxylated copolymer resin, (B) a compound having two or more reactive groups which cure by the action of actinic energy rays, (C) a photopolymerization initiator, and (D) an inorganic filler, the content of the inorganic filler (D) being 65 mass% or higher based on the solid ingredients.
Inventors:
DAIGO YOSHIKAZU (JP)
MINEGISHI SHOJI (JP)
ITOKAWA GEN (JP)
MINEGISHI SHOJI (JP)
ITOKAWA GEN (JP)
Application Number:
PCT/JP2006/310781
Publication Date:
December 07, 2006
Filing Date:
May 30, 2006
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
DAIGO YOSHIKAZU (JP)
MINEGISHI SHOJI (JP)
ITOKAWA GEN (JP)
DAIGO YOSHIKAZU (JP)
MINEGISHI SHOJI (JP)
ITOKAWA GEN (JP)
International Classes:
G03F7/033; C08L33/14; G03F7/004
Domestic Patent References:
| WO2001004705A1 | 2001-01-18 |
Foreign References:
| JP2004271788A | 2004-09-30 | |||
| JP2002148786A | 2002-05-22 | |||
| JP2002122985A | 2002-04-26 | |||
| JP2004085738A | 2004-03-18 | |||
| JPH03153750A | 1991-07-01 |
Attorney, Agent or Firm:
Suzuye, Takehiko c/o SUZUYE & SUZUYE (1-12-9 Toranomo, Minato-ku Tokyo, JP)
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