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Title:
CURABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2022/210442
Kind Code:
A1
Abstract:
A curable resin composition comprising a maleimide resin (A) having a cyclic imide bond and obtained by reacting a diamine (a-1) derived from a dimer acid, a tetracarboxylic dianhydride (a-2), and maleic anhydride, a maleimide resin (B) represented by formula (1), and a curing accelerator (D), the components (A), (B), and (D) being compatible with each other. (In formula (1), the R moieties each independently represent a hydrogen atom or a C1-C5 alkyl group, m is an integer of 0-3, and n, indicating the number of repetitions, is 1

Inventors:
MIZUGUCHI TAKAFUMI (JP)
TAKEDA MAO (JP)
YAMAMOTO KAZUYOSHI (JP)
NISHIMURA KENGO (JP)
Application Number:
PCT/JP2022/014726
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G73/10; C08F222/40; C08L35/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2020054601A12020-03-19
WO2021020563A12021-02-04
WO2020203834A12020-10-08
Foreign References:
JP2021025053A2021-02-22
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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