Title:
CURABLE RESIN COMPOSITION, CURED OBJECT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/100843
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition capable of forming solder resists which combine long-lasting low glossiness and resultant long-term freedom from solder adhesion with withstand voltage on a high level. [Solution] A curable resin composition comprising a curable resin, barium sulfate, and a heat-curing catalyst, the barium sulfate having an oil absorption of 40-70 mL/100 g.
Inventors:
DAIGO YOSHIKAZU (JP)
Application Number:
PCT/JP2022/043882
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L101/00; C08F290/14; C08F299/00; C08K3/24; H05K3/28
Foreign References:
| JP2017057356A | 2017-03-23 | |||
| CN113698669A | 2021-11-26 | |||
| JP2020200449A | 2020-12-17 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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