CURABLE RESIN COMPOSITION AND CURED PRODUCT

WIPO Patent Application WO/2012/133543

A1

The present invention provides a curable resin composition which is capable of forming a thin film that has low refractive index, high transparency and excellent heat resistance. The present invention is a curable resin composition containing a curable fluorine-containing polymer (A) and hollow particles (B), which is characterized in that the curable fluorine-containing polymer (A) is a specific fluorine-containing polymer having a structural unit M that is represented by formula (M). (In the formula, X1 and X2 may be the same or different and each represents H or F; X3 represents H, F, CH3 or CF3; X4 and X5 may be the same or different and each represents H, F or CF3; Rf1 represents an organic group that is a fluorine-containing hydrocarbon group having 1-40 carbon atoms, which may have an amide bond or a urea bond, or a fluorine-containing hydrocarbon group having an ether bond and 2-100 carbon atoms, which may have an amide bond, a carbonate bond, a urethane bond or a urea bond, in said organic group 1-3 hydrogen atoms being substituted by Y1 (Y1 is a functional group that contains at least one hydrolyzable metal alkoxide moiety having 1-30 carbon atoms at an end); a represents an integer of 0-3; and b and c may be the same or different and each represents 0 or 1.)

TANAKA YOSHITO
KANEMURA TAKASHI

PCT/JP2012/058166

October 04, 2012

March 28, 2012

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DAIKIN IND LTD (JP)
TANAKA YOSHITO
KANEMURA TAKASHI

C08L27/12; C08F214/18; C08F216/14; C08F230/08; C08K7/22; C08L29/10; G02B1/10; G02B1/111

JP2007099828A	2007-04-19
JP2008085172A	2008-04-10

YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)

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