Title:
CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2015/163352
Kind Code:
A1
Abstract:
The present invention relates to a curable resin composition which is characterized by containing: at least one polysiloxane (A) that is selected from the group consisting of polyorganosiloxanes (A1) having two or more alkenyl groups in each molecule and polyorganosiloxy silalkylenes (A2) having two or more alkenyl groups in each molecule; at least one polysiloxane (B) that is selected from the group consisting of polyorganosiloxanes (B1) having two or more hydrosilyl groups in each molecule and polyorganosiloxy silalkylenes (B2) having two or more hydrosilyl groups in each molecule; and a compound (C) that is represented by formula (1).
The present invention provides a curable resin composition which is capable of forming a cured product (a sealing material) having excellent thermal shock resistance, excellent reflow resistance and excellent barrier properties against corrosive gases (for example, SOx gases).
Inventors:
YABUNO SHINYA (JP)
TAKENAKA HIROTO (JP)
NAKAGAWA YASUNOBU (JP)
ITAYA RYO (JP)
KAMURO SHIGEAKI (JP)
TAKENAKA HIROTO (JP)
NAKAGAWA YASUNOBU (JP)
ITAYA RYO (JP)
KAMURO SHIGEAKI (JP)
Application Number:
PCT/JP2015/062205
Publication Date:
October 29, 2015
Filing Date:
April 22, 2015
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08L83/07; C08K5/3445; C08K5/37; C08L83/05; C08L83/14; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2015076399A1 | 2015-05-28 | |||
| WO2015033574A1 | 2015-03-12 | |||
| WO2001025360A1 | 2001-04-12 |
Foreign References:
| JP2015059101A | 2015-03-30 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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