CURABLE-RESIN COMPOSITION, CURED PRODUCT OF CURABLE-RESIN COMPOSITION, PRODUCTION METHOD FOR CURABLE-RESIN COMPOSITION AND CURED PRODUCT OF CURABLE-RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2020/218457

A1

[Problem] To provide: a curable-resin composition that has excellent room-temperature stability and is for producing a cured product that is highly heat-resistant, etc.; a cured product of the curable-resin composition; a production method for the curable-resin composition and the cured product; and a semiconductor device that uses the cured product as a sealing material. [Solution] A curable-resin composition that contains (A) a polyfunctional benzoxazine compound that has at least two benzoxazine rings, (B) an epoxy compound that includes at least one type of epoxy compound that has at least one norbornane structure and at least two epoxy groups, and (C) a curing agent, the polystyrene-equivalent weight average molecular weight of a mixture of (A), (B), and (C) being 350–650. A cured product of the curable-resin composition. A production method for the curable-resin composition and the cured product. A semiconductor device in which a semiconductor element is arranged in a cured product that is formed by curing a curable-resin composition that contains components (A)–(C) and, optionally, (D) and (E).

NISHITANI YOSHINORI (JP)
SATO TATSUKI (JP)
MINAMI MASAKI (JP)

PCT/JP2020/017580

October 29, 2020

April 23, 2020

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JXTG NIPPON OIL & ENERGY CORP (JP)

C08G59/24; C08K3/013; C08L63/00; H01L23/29; H01L23/31

WO2017188448A1	2017-11-02
WO2018105743A1	2018-06-14
WO2015002071A1	2015-01-08

US20170327683A1	2017-11-16
JP2017020011A	2017-01-26

NAKAMURA Yukitaka et al. (JP)

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