Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/251052
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a cured product that exhibits excellent heat resistance and dielectric properties (low dielectric properties) through use of a curable resin having a specific structure; and a prepreg, a circuit board, a build-up film, a semiconductor sealing material and a semiconductor device that exhibit these properties. More specifically, the present invention provides a curable resin characterized by having a structural unit (1) represented by general formula (1) and a terminal structure (2) represented by general formula (2). (In general formulae (1) and (2), the details relating to R1, R2, R3, k and X are as described in the main body of text.)
Inventors:
MATSUOKA RYUICHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
Application Number:
PCT/JP2021/018136
Publication Date:
December 16, 2021
Filing Date:
May 13, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G61/02; C08F299/02
Foreign References:
| JP2015189925A | 2015-11-02 | |||
| JP2017066268A | 2017-04-06 | |||
| JPH0543623A | 1993-02-23 | |||
| JPS61145222A | 1986-07-02 | |||
| JPH05222156A | 1993-08-31 | |||
| JPH05194708A | 1993-08-03 | |||
| JP2000212259A | 2000-08-02 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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