CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/045060

A1

A curable resin composition which contains at least one resin that is selected from the group consisting of polyimide precursors and polybenzoxazole precursors, and a compound B that comprises a polymerizable group and at least one structure selected from the group consisting of an oxalic acid monoester structure, an oxalic acid diester structure, an oxalic acid monoamide structure, an oxalic acid diamide structure and an oxalic acid ester amide structure; a cured product which is obtained by curing this curable resin composition; a multilayer body which comprises this cured product; a method for producing this cured product; and a semiconductor device which comprises this cured product or this multilayer body.

JP2751253	Description: Thermosetting Resin Compositions, Films and Adhesives
WO/1996/025441	POLYCARBONATE COMPOSITIONS MODIFIED WITH A POLYAMINE COMPOUND
WO/2018/061644	METAL NITRIDE-CONTAINING PARTICLES, DISPERSION COMPOSITION, CURABLE COMPOSITION, CURED FILM, PRODUCTION METHOD FOR THESE, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING DEVICE, AND INFRARED SENSOR

YOSHIDA KENTA (JP)
YAMAGUCHI SHUHEI (JP)

PCT/JP2021/030784

March 03, 2022

August 23, 2021

Click for automatic bibliography generation  

FUJIFILM CORP (JP)

C08F283/04; B32B15/08; B32B15/088; C08F2/44; C08F290/14; C08G73/10; C08K5/11; C08K5/20; C08L79/04; C08L79/08

WO2018043467A1	2018-03-08
WO2018021262A1	2018-02-01

US5153307A

1992-10-06

SIKs & Co. (JP)

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