Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/137915
Kind Code:
A1
Abstract:
A purpose is to provide a cured product having excellent heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and excellent storage stability. Specifically, provided is a curable resin characterized by being represented by general formula (1) and having a hydroxyl group concentration of 0.005-3800 mmol/kg. (In formula (1), Z is a C2-15 hydrocarbon, Y is a substituent represented by general formula (2), and n represents an integer of 3-5. In formula (2), Ra and Rb each independently represent a C1-12 alkyl group, aryl group, aralkyl group, or cycloalkyl group, m represents an integer of 0-3, and X represents a hydroxyl group, (meth)acryloyloxy group, vinyl benzyl ether group, or allyl ether group.)
Inventors:
MATSUOKA RYUICHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
Application Number:
PCT/JP2021/042358
Publication Date:
June 30, 2022
Filing Date:
November 18, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F20/20
Domestic Patent References:
| WO2021246182A1 | 2021-12-09 |
Foreign References:
| JP2013525569A | 2013-06-20 | |||
| JP2013525568A | 2013-06-20 | |||
| JP2011513581A | 2011-04-28 | |||
| JP2015189925A | 2015-11-02 | |||
| JP2015030776A | 2015-02-16 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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