Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESION FILM
Document Type and Number:
WIPO Patent Application WO/2022/138407
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a curable resin composition that has excellent fluid characteristics before being cured, excellent leach preventing ability when being semi-cured, and excellent heat resistance after being fully cured. Another purpose of the present invention is to provide: a cured product of said curable resin composition; and an adhesive agent and an adhesion film which are obtained by using said curable resin composition. This curable resin composition contains a curable resin, a photoinitiator, and a thermosetting agent. The thermosetting agent contains an imide oligomer.
Inventors:
WAKIOKA SAYAKA (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
TAKEDA KOHEI (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
TAKEDA KOHEI (JP)
Application Number:
PCT/JP2021/046401
Publication Date:
June 30, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F290/06; C08F2/44; C08F2/50; C08F290/14; C08G59/40; C09J4/02; C09J7/35; C09J11/08; C09J163/00; C09J163/10; C09J201/00
Domestic Patent References:
| WO2018193983A1 | 2018-10-25 | |||
| WO2018139558A1 | 2018-08-02 | |||
| WO2021241548A1 | 2021-12-02 |
Foreign References:
| JP2002006490A | 2002-01-09 | |||
| JP2004502859A | 2004-01-29 | |||
| JPS61270852A | 1986-12-01 | |||
| JP2007091799A | 2007-04-12 | |||
| JP2003162055A | 2003-06-06 | |||
| US20160177018A1 | 2016-06-23 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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