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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/190745
Kind Code:
A1
Abstract:
A curable resin composition that contains (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen–containing amine latent curing agent, and (D) an ion scavenger. The (A) cyanate ester resin is preferably one type of compound selected from the group that consists of compounds represented by formula (1), compounds represented by formula (2), and polymers of at least one type of compound selected therefrom. (1) NC-O-A1-Y1-A2-O-CN (See the description for the symbols in the formula.) (2) (See the description for the symbols in the formula.)

Inventors:
HIRAYAMA KOHEI (JP)
OTA KEISUKE (JP)
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
Application Number:
PCT/JP2022/004965
Publication Date:
September 15, 2022
Filing Date:
February 08, 2022
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/56; C08K3/01; C08L63/00; C09J11/04; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
WO2016157259A12016-10-06
WO2020021968A12020-01-30
WO2008053694A12008-05-08
Foreign References:
JP2020200389A2020-12-17
JP2014232854A2014-12-11
JP2021015932A2021-02-12
JP2013170254A2013-09-02
JP2017103332A2017-06-08
US6469074B12002-10-22
JPS60250026A1985-12-10
US6342577B12002-01-29
US20120178853A12012-07-12
US20120309923A12012-12-06
US20190031790A12019-01-31
JP2017103332A2017-06-08
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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