Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/220253
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said curable resin composition, as well as an adhesive agent and adhesive film which are obtained by using said curable resin composition. The present invention is a curable resin composition containing a curable resin, a curing agent, and a thermally conductive filler, wherein the curing agent includes an imide oligomer and the thermal conductivity of the curable resin composition after being cured is 1 W/mK or more.
Inventors:
WAKIOKA SAYAKA (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
KOUMA AKI (JP)
SHINDO MASAMI (JP)
NISHIZAWA HIDEHITO (JP)
OWASHI KEIGO (JP)
HOUJOU KENTAROU (JP)
NAKAMURA YUU (JP)
KOUMA AKI (JP)
SHINDO MASAMI (JP)
NISHIZAWA HIDEHITO (JP)
OWASHI KEIGO (JP)
Application Number:
PCT/JP2022/017656
Publication Date:
October 20, 2022
Filing Date:
April 13, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; C08G73/10; C08L101/00; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J179/02; C09J179/04; C09J201/00
Domestic Patent References:
| WO2018139558A1 | 2018-08-02 | |||
| WO2020054218A1 | 2020-03-19 |
Foreign References:
| JP2017149910A | 2017-08-31 | |||
| JP2010132793A | 2010-06-17 | |||
| JP2010189470A | 2010-09-02 | |||
| JP2012077172A | 2012-04-19 | |||
| JP2015108139A | 2015-06-11 | |||
| JP2016172824A | 2016-09-29 | |||
| JP2018087305A | 2018-06-07 | |||
| JP2003193016A | 2003-07-09 | |||
| JP2005113059A | 2005-04-28 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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