Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/136098
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a curable resin composition from which a cured product having high reliability can be obtained. Another purpose of the present invention is to provide a cured product of the aforesaid curable resin composition, as well as an adhesive agent and an adhesive film obtained by using the curable resin composition. The present invention relates to a curable resin composition that contains a curable resin and a curing agent, said curing agent having a structure derived from a diamine represented by formula (1), wherein, when a cured product thereof is subjected to a temperature cycling test under the conditions of -55°C to 150°C and 1000 cycles, the change rate of storage modulus of the cured product at 25°C before and after the temperature cycling test is 25% or less, and the change rate of storage modulus of the cured product at 150°C before and after the temperature cycling test is 250% or less.
Inventors:
HOUJOU KENTAROU (JP)
WAKIOKA SAYAKA (JP)
NAKAMURA YUU (JP)
WAKIOKA SAYAKA (JP)
NAKAMURA YUU (JP)
Application Number:
PCT/JP2022/047610
Publication Date:
July 20, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08G59/40
Foreign References:
| JP2020200413A | 2020-12-17 | |||
| JP2018203991A | 2018-12-27 | |||
| JP2015021020A | 2015-02-02 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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