Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/157587
Kind Code:
A1
Abstract:
Provided are: a curable resin composition which attains not only the properties required of solder resists, including soldering heat resistance, but also a high reflectance; a dry film; a cured object; and a printed wiring board.
The curable resin composition comprises (A) a curable resin, (B) a white colorant, (C) a fluorescent brightener, and (D) an isocyanate compound and/or a coupling agent. The dry film has a resin layer obtained by applying the curable resin composition to a film and drying the composition. The cured object is obtained by curing either the curable resin composition or a resin layer obtained by applying and drying the curable resin composition. The printed wiring board includes the cured object.
Inventors:
SHIMAMIYA AYUMU (JP)
Application Number:
PCT/JP2015/080454
Publication Date:
October 06, 2016
Filing Date:
October 28, 2015
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L101/00; C08K5/29; C08K5/54; G03F7/004; H05K3/28
Domestic Patent References:
| WO2011118108A1 | 2011-09-29 | |||
| WO2011118109A1 | 2011-09-29 | |||
| WO2013137257A1 | 2013-09-19 | |||
| WO2014027654A1 | 2014-02-20 | |||
| WO2010067780A1 | 2010-06-17 | |||
| WO2015008744A1 | 2015-01-22 | |||
| WO2012141124A1 | 2012-10-18 |
Foreign References:
| JP2014221856A | 2014-11-27 | |||
| JPH04296819A | 1992-10-21 | |||
| JP2012041428A | 2012-03-01 | |||
| JP2012063428A | 2012-03-29 | |||
| JP2012063430A | 2012-03-29 | |||
| JPH08171863A | 1996-07-02 | |||
| JP2012004553A | 2012-01-05 |
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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