Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/128257
Kind Code:
A1
Abstract:
Provided are a curable resin composition from which a cured article can be obtained with excellent resistance to welding and thermal performance and also excellent flexibility and warpage, a dry film, a cured article, and a printed circuit board . The curable resin composition comprises (A) a carboxyl containing resin, (B) a photopolymerization initiator, and (C) an ethylenically unsaturated group-containing compound having five or more alkylene oxide skeletons. As the component (A), it contains (A1) a carboxyl group-containing photosensitive resin formed through enabling an epoxy resin to react with a carboxylic acid having the ethylenically unsaturated group, enabling the resulting hydroxyl to react with an acid anhydride, and adding a compound having a glycidyl and an ethylenically unsaturated group to the resulting carboxyl containing resin. The component (C) contains at least two kinds of ethylenically unsaturated group-containing compounds.
Inventors:
FUKUDA SHINICHIRO (CN)
YAMAMOTO SHUICHI (CN)
DONG SIYUAN (CN)
WANG YUBIN (CN)
YAMAMOTO SHUICHI (CN)
DONG SIYUAN (CN)
WANG YUBIN (CN)
Application Number:
PCT/CN2018/100676
Publication Date:
July 04, 2019
Filing Date:
August 15, 2018
Export Citation:
Assignee:
TAIYO INK SUZHOU CO LTD (CN)
International Classes:
G03F7/027; C08F2/48; C08F290/06; C08F299/02; C08L63/10; G03F7/004; H05K3/28; H05K3/46
Domestic Patent References:
| WO2000068740A1 | 2000-11-16 |
Foreign References:
| CN1420998A | 2003-05-28 | |||
| CN101220225A | 2008-07-16 | |||
| CN101846882A | 2010-09-29 | |||
| JP2004062057A | 2004-02-26 |
Attorney, Agent or Firm:
LINDA LIU & PARTNERS (CN)
Download PDF:
Previous Patent: CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD
Next Patent: METHOD FOR PREPARING SLOWLY-DIGESTED SUGAR
Next Patent: METHOD FOR PREPARING SLOWLY-DIGESTED SUGAR