Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED OBJECT, LAYERED STRUCTURE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/187587
Kind Code:
A1
Abstract:
Provided are: a curable resin composition capable of giving a cured object which has excellent adhesion to roughening-free substrates or low-profile substrates, while retaining physical properties including low CTE; a dry film including a resin layer obtained from the composition; a cured object obtained by curing a resin layer which is either the composition or the dry film; a layered structure including a cured resin layer comprising the cured object; and an electronic component including the cured object. The curable resin composition is characterized by comprising a curable resin and surface-treated silica particles having a positive zeta potential.
Inventors:
UETA CHIHO (JP)
OKADA KAZUYA (JP)
SHIMADA SAWAKO (JP)
KUDO TOMOYA (JP)
OKADA KAZUYA (JP)
SHIMADA SAWAKO (JP)
KUDO TOMOYA (JP)
Application Number:
PCT/JP2019/002808
Publication Date:
October 03, 2019
Filing Date:
January 28, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L101/00; B32B27/18; C08K9/02; G03F7/004; G03F7/027; H01L23/14; H01L23/29; H01L23/31; H05K3/28
Foreign References:
| JP2017132864A | 2017-08-03 | |||
| JP2008074635A | 2008-04-03 | |||
| JP2004292219A | 2004-10-21 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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